Application of viscoplastic-creep separate constitutive model to lead-free solder alloys

被引：0
|
作者：
Hayashi, Takeharu [1 ]
Ebihara, Yoshinori [1 ]
Asai, Tatsuhiko [1 ]
Watanabe, Hirohiko [1 ]
机构：
[1] Tokyo Metropolitan Koganei Technical High School, Hon-cho 6-8-9, Koganei-shi, Tokyo, 184-8501, Japan
来源：
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A | 2011年 / 77卷 / 780期
关键词：
Compendex;
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学科分类号：
摘要：
Stress relaxation
引用
收藏
页码：1169 / 1177
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