共 50 条
- [44] High Performance 3D Package Technology for Mobile Application Processor (AP) PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 348 - 352
- [47] 3D Printed Electronics NIP29: 29TH INTERNATIONAL CONFERENCE ON DIGITAL PRINTING TECHNOLOGIES / DIGITAL FABRICATION 2013, 2013, : 9 - 12
- [49] Wafer Level Embedding Technology for 3D Wafer Level Embedded Package 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1289 - +