Curing kinetics of block copolymerization thermoset polyurethane by non-isothermal DSC method

被引:0
|
作者
Li, Tianqi [1 ]
Xu, Junjie [1 ]
An, Mengjing [1 ]
Wang, Teng [1 ]
Ma, Yuzhi [1 ]
Luo, Yunjun [1 ,2 ]
机构
[1] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China
[2] Beijing Inst Technol, Key Lab, Minist Educ, Minist Educ High Energy Dens Mat, Beijing, Peoples R China
关键词
curing kinetics; non-isothermal DSC; polyurethan; thermoset; THERMAL-ANALYSIS; EPOXY; PERFORMANCE; POLYESTER; COATINGS; MECHANISMS; SYSTEM;
D O I
10.1002/app.56374
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Polyurethanes consist of hard and soft segments, with the hard segments typically comprising blocks containing isocyanate groups, while the soft segments often consist of chains terminated with hydroxyl groups. The hard segments contribute to the mechanical properties of polyurethanes, while the soft segments provide elasticity and flexibility. The essence of curing lies in the mixing of hard and soft segments and subjecting the system to high temperatures. The curing kinetics of PEG/PCL/IPDI/N100 in-situ block copolymers were investigated using dynamic isothermal differential scanning calorimetry (DSC). Key curing parameters were obtained from non-isothermal DSC curves, and these parameters were incorporated into an n-order reaction model to determine the reaction type and apparent activation energy, thus deriving the reaction equation. The curing kinetics of PEG/PCL/IPDI/N100 in-situ block copolymers follows an n-th order autocatalytic reaction, where n is 1, and the activation energy is approximately 52.79 kJ/mol. Based on the reaction equation, the curing process conditions, namely the initial curing temperature (T-i), the peak exothermic temperature (T-p), and the finishing temperature (T-f), were deduced. Studying the curing kinetics of thermosetting polyurethanes can deepen our understanding of the interactions and reaction mechanisms between reactants under different conditions, thereby enhancing our grasp of the curing process. Furthermore, research into curing kinetics can provide a basis for optimizing preparation processes.
引用
收藏
页数:9
相关论文
共 50 条
  • [21] Cure kinetics of epoxy resins studied by non-isothermal DSC data
    Rosu, D
    Cascaval, CN
    Mustata, F
    Ciobanu, C
    THERMOCHIMICA ACTA, 2002, 383 (1-2) : 119 - 127
  • [22] Comparative studies on the non-isothermal DSC curing kinetics of an unsaturated polyester resin using free radicals and empirical models
    Martin, JL
    Cadenato, A
    Salla, JM
    THERMOCHIMICA ACTA, 1997, 306 (1-2) : 115 - 126
  • [23] A new method for the analysis of non-isothermal DSC and diffraction data
    Kennedy, JA
    Clark, SM
    THERMOCHIMICA ACTA, 1997, 307 (01) : 27 - 35
  • [24] Cure kinetics of DGEBA with hyperbrancbed poly (3-hydroxyphenyl) phosphate as curing agent studied by non-isothermal DSC
    Yao, L
    Deng, J
    Qu, BJ
    Shi, WF
    CHEMICAL RESEARCH IN CHINESE UNIVERSITIES, 2006, 22 (01) : 118 - 122
  • [26] Modeling and simulation of curing kinetics for the cardanol-based vinyl ester resin by means of non-isothermal DSC measurements
    Sultania, Minakshi
    Rai, J. S. P.
    Srivastava, Deepak
    MATERIALS CHEMISTRY AND PHYSICS, 2012, 132 (01) : 180 - 186
  • [27] A method for the non-isothermal crystallization kinetics of polymers
    Mo Zhishen
    ACTA POLYMERICA SINICA, 2008, (07): : 656 - 661
  • [28] EPOXY POLYMERS - USE AND MISUSE OF NON-ISOTHERMAL DTA AND DSC IN THE STUDY OF THE CURING PROCESS
    SCHIRALDI, A
    BALDINI, P
    JOURNAL OF THERMAL ANALYSIS, 1983, 28 (02): : 295 - 302
  • [29] Curing reaction kinetics of heat-resistant epoxy resin system by non-isothermal method
    College of Materials Science and Engineering, Tianjin Polytechnic University, Tianjin
    300387, China
    不详
    Shandong
    253600, China
    不详
    250061, China
    Cailiao Gongcheng, 8 (67-71):
  • [30] Non-isothermal Curing Kinetics of Modified Amine-Epoxy Asphalt
    Mao, Jingbo
    Cheng, Dejin
    Wang, Jie
    Song, Jiale
    Li, Weiguang
    PROCEEDINGS OF THE6TH INTERNATIONAL CONFERENCE ON MECHATRONICS, MATERIALS, BIOTECHNOLOGY AND ENVIRONMENT (ICMMBE 2016), 2016, 83 : 108 - 113