The fundamentals of low-temperature silver brazing - Part 2: Joint design

被引：0
|
作者：
Roberts, P.M. [1 ]
机构：
[1] Delphi Brazing Consultants, Congleton, Cheshire, United Kingdom
来源：
Welding and Cutting | 2012年 / 11卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：38 / 41
相关论文
共 50 条
  • [41] Low-temperature resistance and its temperature dependence in nanostructured silver
    Qin, XY
    Zhang, W
    Zhang, LD
    Jiang, LD
    Liu, XJ
    Jin, D
    PHYSICAL REVIEW B, 1997, 56 (16): : 10596 - 10604
  • [42] MAGNETIC PART OF LOW-TEMPERATURE RESISTIVITY OF FERROMAGNETS
    DYAKINA, VP
    VOLKENSH.NV
    PHYSICS OF METALS AND METALLOGRAPHY-USSR, 1968, 26 (04): : 52 - &
  • [43] Low-Temperature Predicted Structures of Ag2S (Silver Sulfide)
    Sadovnikov, Stanislav I.
    Kostenko, Maksim G.
    Gusev, Aleksandr I.
    Lukoyanov, Aleksey V.
    NANOMATERIALS, 2023, 13 (19)
  • [44] OVERALL DESIGN OF LOW-TEMPERATURE PROCESSES
    DHOLE, VR
    LINNHOFF, B
    COMPUTERS & CHEMICAL ENGINEERING, 1994, 18 (SUPPL) : S105 - S111
  • [45] FLUXLESS BRAZING OF ALUMINUM AND ITS ALLOYS WITH LOW-TEMPERATURE SOLDERS ALLOYED WITH GALLIUM
    KHLUDOV, EA
    WELDING PRODUCTION, 1976, 23 (09): : 38 - 40
  • [46] Low-temperature brazing of alumina ceramics with bismuth-borate glass in air
    Guo, Wei
    Fu, Li
    He, Peng
    Lin, Tiesong
    Shen, Zhikang
    Liu, Xiao Chao
    Wang, Tong
    Wang, Chunyue
    MATERIALS CHARACTERIZATION, 2019, 149 : 158 - 164
  • [47] LOW-TEMPERATURE LARGE-AREA BRAZING OF DAMAGE TOLERANT TITANIUM STRUCTURES
    WELLS, RR
    WELDING JOURNAL, 1975, 54 (10) : S348 - S356
  • [48] Low-Temperature Brazing of Titanium Using Al-Based Filler Alloys
    Muhrat, A.
    Puga, H.
    Barbosa, J.
    ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2018, 2018
  • [49] ANOMALIES IN THE LOW-TEMPERATURE THERMAL AND ELECTRICAL RESISTIVITIES OF SILVER
    KOS, JF
    JOURNAL OF PHYSICS-CONDENSED MATTER, 1990, 2 (22) : 4859 - 4868
  • [50] LOW-TEMPERATURE SILVER GLASS DIE ATTACH MATERIAL
    HERRINGTON, TL
    FERRIER, GG
    SMITH, HL
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 640 - 655
12345