共 50 条
- [32] Structures and materials of system-in-package: A review Recent Patents on Mechanical Engineering, 2021, 14 (01): : 28 - 41
- [33] Interconnect Technologies for System-in-Package Integration PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 641 - 646
- [35] Ground bounce noise isolation with power plane segmentation in system-in-package (SiP) 2007 5TH INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY PROCEEDINGS, 2007, : 460 - +
- [36] Novel 3-D Coaxial Interconnect System for Use in System-in-Package Applications IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2010, 33 (01): : 37 - 47
- [38] Thermal modeling and analysis of a power ball grid array in system-in-package technology Multiscale and Multidisciplinary Modeling, Experiments and Design, 2022, 5 : 31 - 41
- [39] Development of an intelligent integrated LED system-in-package EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
- [40] A System-In-Package based Energy Harvesting for IoT Devices with Integrated Voltage Regulators and Embedded Inductors 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1726 - 1731