共 50 条
- [31] Package Defect Test System and Its Application in Assembly Improvement 2018 IEEE 38TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2018,
- [32] PACKAGE TUNNEL KILN - ITS APPLICATION TO HEAVY CLAY PRODUCTS AMERICAN CERAMIC SOCIETY BULLETIN, 1971, 50 (04): : 440 - &
- [35] The Comparison of Package Design and Electrical Analysis in Mobile Application 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1855 - 1860
- [36] Construction Analysis of Flip Chip Package for Aerospace Application 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 203 - 206
- [40] Rights trading system and its application to electronic commerce NTT R and D, 2000, 49 (11): : 678 - 684