A study of vacuum diffusion bonding and interface structure of Ti/Al dissimilar materials

被引：0
|
作者：
Li, Ya-Jiang [1 ,2 ]
Gerasimov, S.A. [2 ]
Wang, Juan [1 ]
Ma, Hai-Jun [1 ]
Ren, Jiang-Wei [1 ]
机构：
[1] Key Lab. of Liquid Structure and Heredity of Materials, Shandong University, Jinan 250061, China
[2] Materials Science and Engineering Department, Bauman Moscow State Technical University, Moscow 105005, Russia
来源：
Cailiao Kexue yu Gongyi/Material Science and Technology | 2007年 / 15卷 / 02期
关键词：
Aluminum - Dissimilar materials - Interfaces (materials) - Intermetallics - Microhardness - Microstructure - Scanning electron microscopy - Titanium sheet - Vacuum - X ray diffraction analysis;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Ti/Al dissimilar materials were successfully bonded together by means of vacuum diffusion bonding after aluminizing on the surface of Ti sheet. The microstructure and phase constituent for the Ti/Al diffusion bonded joint were analyzed by means of scanning electron microscopy (SEM), microsclerometer and X-ray diffractometry (XRD). The test results indicated that Ti/Al diffusion joint included Ti side interface, diffusion transition zone and Al side interface. Intermetallics Ti3Al, TiAl and TiAl3 were formed in the transition zone near Ti/Al interface. Controlling technology parameters of diffusion bonding could reduce the thickness of intermetallics layer. The microhardness of the Al substrate away from the diffusion interface was 30-40HM. There was no obvious brittle phase near the Ti/Al interface of Ti substrate and transition zone.
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页码：206 / 210
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