Investigation of a novel nanodiamond-impregnated polishing pad for oxide chemical mechanical polishing

被引:0
|
作者
Tsai, Ming-Yi [1 ]
Chen, Chien-Hsun [1 ]
机构
[1] Department of Mechanical Engineering, National Chin-Yi University of Technology, Taichung County, 411, Taiwan
来源
Journal of Technology | 2013年 / 28卷 / 04期
关键词
Chemical mechanical polishing;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:235 / 241
相关论文
共 50 条
  • [41] Contact Behavior and Chemical Mechanical Polishing (CMP) Performance of Hole-Type Polishing Pad
    Kim, Hong Jin
    Choi, Jae Kwang
    Hong, Myung Ki
    Lee, Kuntack
    Ko, Yongsun
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2012, 1 (04) : P204 - P209
  • [42] Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing
    Shin, Cheolmin
    Kulkarni, Atul
    Kim, Kangjun
    Kim, Hojoong
    Jeon, Sanghuck
    Kim, Eungchul
    Jin, Yinhua
    Kim, Taesung
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 97 (1-4): : 563 - 571
  • [43] Analysis on the Contact Pressure Distribution of Chemical Mechanical Polishing by the Bionic Polishing Pad with Phyllotactic Pattern
    Lv, Y. S.
    Li, N.
    Wang, J.
    Zhang, T.
    Duan, M.
    Xing, X. L.
    DIGITAL DESIGN AND MANUFACTURING TECHNOLOGY II, 2011, 215 : 217 - 222
  • [44] The effect of the polishing pad treatments on the chemical-mechanical polishing of SiO2 films
    Li, WD
    Shin, DW
    Tomozawa, M
    Murarka, SP
    THIN SOLID FILMS, 1995, 270 (1-2) : 601 - 606
  • [45] An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing
    N. Y. Nguyen
    Z. W. Zhong
    Yebing Tian
    The International Journal of Advanced Manufacturing Technology, 2015, 77 : 897 - 905
  • [46] A new chemical mechanical planarization with the frozen chemical etchant as a polishing pad
    Kim, YW
    Yoo, JO
    Jung, TW
    Oh, YJ
    Chung, CH
    2001 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, PROCEEDINGS, 2001, : 30 - 33
  • [47] Study on pad-free chemical mechanical polishing technology
    Zhongguo Jixie Gongcheng, 2008, 20 (2407-2411):
  • [48] A model of pad-abrasive interactions in chemical mechanical polishing
    Paul, Ed
    Horn, John
    Li, Ying
    Babu, S. V.
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2007, 10 (04) : H131 - H133
  • [49] The effect of pad wear on the chemical mechanical polishing of silicon wafers
    Byrne, G
    Mullany, B
    Young, P
    CIRP ANNALS 1999 - MANUFACTURING TECHNOLOGY, 1999, : 143 - 146
  • [50] Effects of pad properties on material removal in chemical mechanical polishing
    Park, K. H.
    Kim, H. J.
    Chang, O. M.
    Jeong, H. D.
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2007, 187 : 73 - 76