High Current, High Density Mounting, and High Heat Dissipation for Printed Circuit Boards That Support Electrification

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Journal of the Institute of Electrical Engineers of Japan | 2023年 / 143卷 / 08期
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Compendex;
D O I：
10.1541/IEEJJOURNAL.143.517
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[No abstract available]
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页码：517 / 520
页数：3
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