Electrical, optical and fluidic through-silicon vias for silicon interposer applications

被引：0
|
作者：
Georgia Institute of Technology, 791 Atlantic Drive, Atlanta, GA 30332, United States [1 ]
机构：
来源：
Proc Electron Compon Technol Conf | 2011年 / 1992-1998期
关键词：
Compendex;
D O I：
5898790
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学科分类号：
摘要：
Silicon
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