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- [1] Electrical, Optical and Fluidic Through-Silicon Vias for Silicon Interposer Applications 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1992 - 1998
- [4] Silicon Interposer Platform With Low-Loss Through-Silicon Vias Using Air 2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
- [5] Electrical Behaviour of Carbon Nanotube Through-Silicon Vias 2011 15TH IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS (SPI), 2011, : 75 - 78
- [6] Electrical-Thermal Co-Simulation for power redistribution layers of Interposer with Through-Silicon Vias 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 492 - 497
- [7] Novel TEM applications to characterize through-silicon vias Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, : 144 - 147
- [8] A Silicon Interposer With an Integrated SrTiO3 Thin Film Decoupling Capacitor and Through-Silicon Vias IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2010, 33 (03): : 582 - 587