Process liquid reduction in grinding

被引：0
|
作者：
Holešovský F. [1 ]
Hrala M. [2 ]
机构：
[1] Institute of Production Technology and Management, J.E.Purkyne University, Ústí nad Labem 40096
[2] Czech Technical University, Prague
来源：
International Journal of Computational Materials Science and Surface Engineering | 2009年 / 3卷 / 01期
关键词：
Grinding; Process liquid; Reduction; Surface quality;
D O I：
10.1504/IJCMSSE.2010.029681
中图分类号：
学科分类号：
摘要：
The friction between the grain and material characterises the grinding in the contact place of the grinding grain with the workpiece. The following elastic and plastic deformation is finished by the chip cutting. The whole process takes place in the real surroundings, where a process liquid forms. The proportion of the dimension of the mechanical and thermal loading, which is caused by the deformation and friction, predicts the surface quality - the integrity. The following experiment deals especially with the influence of the process liquid. Copyright © 2010 Inderscience Enterprises Ltd.
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收藏
页码：43 / 51
页数：8
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