The effect of component concentrations in electroless nickel plating solution on topography and microrelief of Ni-P coatings

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作者：
Perm State University, ul. Bukireva 15, Perm, 614990, Russia [1 ]
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来源：
Russ J Electrochem | 2008年 / 2卷 / 147-157期
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D O I：
10.1134/s102319350802002x
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