IEEE Transactions on Haptics: Welcome message

被引：0
|
作者：
Luh, Peter B. [1 ]
机构：
[1] IEEE Transactions on Haptics Management Committee, United States
来源：
| 2008年 / Institute of Electrical and Electronic Engineers, 445 Hoes Lane, PO Box 1331, Piscataway, 08855 - 1331, United States卷 / 01期
关键词：
D O I：
10.1109/TOH.2008.12
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [11] IEEE CEC 2024 Welcome Message
    Xue, Bing
    2024 IEEE Congress on Evolutionary Computation, CEC 2024 - Proceedings, 2024,
  • [12] 2024 IEEE LAUS Welcome Message
    Brum, Javier
    Pavan, Theo
    Lavarello, Roberto
    Silva, Glauber
    2024 IEEE UFFC Latin America Ultrasonics Symposium, LAUS 2024 - Proceedings, 2024,
  • [13] Message from the IEEE haptics technical committee and task force
    Tan, Hong Z.
    Harders, Matthias
    Kajimoto, Hiroyuki
    Proceedings - Second Joint EuroHaptics Conference and Symposium on Haptic Interfaces for Virtual Environment and Teleoperator Systems, World Haptics 2007, 2007,
  • [14] Welcome Message from IEEE Indonesia Section
    Jatmiko, Wisnu
    Kurnianingsih
    2019 IEEE International Conference on Communication, Networks and Satellite, Comnetsat 2019 - Proceedings, 2019,
  • [15] Welcome Message from IEEE EMBS President
    Armentano, Ricardo L.
    Monzon, Jorge E.
    Hudson, Donna
    Patton, James L.
    2010 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC'10, 2010,
  • [16] Welcome message from IEEE EMBS president
    Liang, Zhi-Pei
    Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, 2011,
  • [17] FUZZ-IEEE 2024 Welcome Message
    Auephanwiriyakul, Sansanee
    Proceedings of the International Joint Conference on Neural Networks, 2024,
  • [18] Welcome message from IEEE EMBS president
    Proc. Annu. Int. Conf. IEEE Eng. Med. Biol. Soc.: Eng. Future Biomed., EMBC, 2009,
  • [19] Welcome Message CHAIR IEEE MALAYSIA SECTION
    Ramli, Nordin
    IEEE Region 10 Humanitarian Technology Conference, R10-HTC, 2024,
  • [20] IEEE-NEMS 2010 welcome message
    Tian, Zhongqun
    Sun, Daoheng
    Lin, Liwei
    Guo, Hang
    2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, 2010,
12345