PI/CB conductive composites with low percolation threshold prepared by electrospinning technique

Carbon black (CB) as conductive fillers was added into polyimide matrix, the high performance conductive composite was fabricated. Polyamide acid (PAA) (the precursor of polyimide)/CB solution was firstly prepared by the in-situ polymerization method, then it was electrospun into nanofiber mat, at last, it was laminated into the thin plate by the hot-press process. Conductive properties, mechanical properties and thermostability of composites were characterized by LCR digital meter, tensile test and thermal gravimetric analysis (TGA). The results show that the percolation threshold of PI/CB composites is low to 6%. The tensile stress and 10% mass loss temperature (T10%) are 93.9 MPa and 575.8°C, respectively, at the percolation threshold. PI/CB composites represent excellent mechanical properties and thermal properties.