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- [41] Welcome Message from Shin-Puu Jeng, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2024,
- [42] Welcome Message from Shen-Li Fu, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2019-October
- [43] Welcome Message from Conference Co-Chair Chih-I Wu Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2016,
- [44] Welcome Message from Chih-I Wu , Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2020, 2020-October
- [45] Welcome Message from Shen-Li Fu, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2022, 2022-October
- [46] Welcome message from Shen-Li Fu, conference co-chair IMPACT Conference 2009 International 3D IC Conference - Proceedings, 2009,
- [47] General Co-Chair Welcome Message 22nd International Symposium on Communications and Information Technologies, ISCIT 2023, 2023,
- [48] MESSAGE FROM CONFERENCE CO-CHAIR (S) 10th International Conference on Electrical Energy Systems, ICEES 2024, 2024,
- [49] Welcome Message from Co-Chair of the Organizing Committee Auer, Michael, 1600, Institute of Electrical and Electronics Engineers Inc.