A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading

被引：0
|
作者：
Gomatam, Rajesh R. [1 ]
Sancaktar, Erol [2 ]
机构：
[1] Materials and Manufacturing Laboratory, Department of Mechanical Engineering, and Mechanics, Lehigh University, Bethlehem, PA 18015, United States
[2] Department of Polymer Engineering, University of Akron, Akron, OH 44325-0301, United States
来源：
Journal of Adhesion Science and Technology | 2006年 / 20卷 / 01期
关键词：
29;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
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页码：69 / 86
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