Wafer level hermetic packaging based on electroplating Cu-Sn alloy films

被引：0
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作者：
机构：
[1] Du, Li-Dong
[2] Zhao, Zhan
[3] Fang, Zhen
[4] Sun, Xue-Jin
[5] Wang, Xiao-Lei
来源：
Du, Li-Dong | 1600年 / Chinese Academy of Sciences卷 / 22期
关键词：
X ray diffraction analysis;
D O I：
10.3788/OPE.20142211.3044
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学科分类号：
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