Oriented lapping of SiC wafers

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作者
Zhao, Shu-Feng [1 ]
Chen, Zhi-Ming [1 ]
Pan, Pan [1 ]
Wang, Huan-Huan [1 ]
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[1] Department of Electronic Engineering, Xi'an University of Technology, Xi'an 710048, China
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页码:365 / 368
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