Application of experimental and finite element modal analysis in development of a novel solder joint inspection systems

被引：0
|
作者：
Zhang, Lizheng [1 ]
Ume, I. Charles [1 ]
机构：
[1] Georgia Institute of Technology, Atlanta, GA 30332, United States
来源：
Journal of Microelectronics and Electronic Packaging | 2008年 / 5卷 / 03期
关键词：
D O I：
10.4071/1551-4897-5.3.97
中图分类号：
学科分类号：
摘要：
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页码：97 / 103
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