Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

被引：0
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作者：
Nihon Superior Centre for the Manufacture of Electronic Materials , School of Mechanical and Mining Engineering, University of Queensland, St Lucia [1 ]
QLD
4072, Australia
不详 [2 ]
02600, Malaysia
不详 [3 ]
606-8501, Japan
不详 [4 ]
574-8530, Japan
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来源：
Scripta Mater | / 17-20期
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Engineering Village;
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学科分类号：
摘要：
Dissolution reactions - Experimental evidence - Growth mechanisms - IMC layer - In-situ observations - Sequence of events - Solid-liquid interfaces - Synchrotron x rays
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