Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

被引：0
|
作者：
Nihon Superior Centre for the Manufacture of Electronic Materials , School of Mechanical and Mining Engineering, University of Queensland, St Lucia [1 ]
QLD
4072, Australia
不详 [2 ]
02600, Malaysia
不详 [3 ]
606-8501, Japan
不详 [4 ]
574-8530, Japan
机构：
来源：
Scripta Mater | / 17-20期
关键词：
Engineering Village;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Dissolution reactions - Experimental evidence - Growth mechanisms - IMC layer - In-situ observations - Sequence of events - Solid-liquid interfaces - Synchrotron x rays
引用
收藏
相关论文
共 50 条
  • [1] Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
    Salleh, M. A. A. Mohd
    McDonald, S. D.
    Yasuda, H.
    Sugiyama, A.
    Nogita, K.
    SCRIPTA MATERIALIA, 2015, 100 : 17 - 20
  • [2] Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints
    Zhao Ning
    Zhong Yi
    Huang Ming-Liang
    Ma Hai-Tao
    Liu Xiao-Ping
    ACTA PHYSICA SINICA, 2015, 64 (16)
  • [3] Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
    Zhao, N.
    Zhong, Y.
    Huang, M. L.
    Ma, H. T.
    Dong, W.
    SCIENTIFIC REPORTS, 2015, 5
  • [4] Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
    N. Zhao
    Y. Zhong
    M.L. Huang
    H.T. Ma
    W. Dong
    Scientific Reports, 5
  • [5] Microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under ultrasonic waves
    Niu, Hongwei
    Bian, Hong
    Wang, Jian
    Song, Xiaoguo
    Zhao, Hongyun
    WELDING IN THE WORLD, 2025,
  • [6] Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces
    Zhang, Z. H.
    Li, M. Y.
    Liu, Z. Q.
    Yang, S. H.
    ACTA MATERIALIA, 2016, 104 : 1 - 8
  • [7] Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces
    Yang, Ming
    Li, Mingyu
    Wu, Jianxin
    Xu, Jinhua
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 1181 - 1185
  • [8] On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
    Anil Kunwar
    Haoran Ma
    Haitao Ma
    Bingfeng Guo
    Zhixian Meng
    Ning Zhao
    Mingliang Huang
    Journal of Materials Science: Materials in Electronics, 2016, 27 : 7699 - 7706
  • [9] On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
    Kunwar, Anil
    Ma, Haoran
    Ma, Haitao
    Guo, Bingfeng
    Meng, Zhixian
    Zhao, Ning
    Huang, Mingliang
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (07) : 7699 - 7706
  • [10] The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5
    Wang, Kuang-Kuo
    Gan, Dershin
    Hsieh, Ker-Chang
    THIN SOLID FILMS, 2014, 562 : 398 - 404
12345