Effects of hygrothermal aging on anisotropic conductive adhesive joints: Experiments and theoretical analysis

被引：0
|
作者：
Lin, Y.C. [1 ,2 ]
Chen, X. [1 ]
Wang, Z.P. [3 ]
机构：
[1] School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China
[2] School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
[3] China Technology Center, Philips Mobile Display Systems, Shanghai 200131, China
来源：
Journal of Adhesion Science and Technology | 2006年 / 20卷 / 12期
关键词：
Epoxy-based anisotropic conductive adhesive film (ACF) joints have been used in a number of interconnect applications; including direct chip attachment; i.e; chip on glass; chip on ceramics; etc. The ACF joints can be subjected to high relative humidity environment and are susceptible to moisture sorption; especially at elevated temperatures. The long-term hygrothermal aging will induce irreversible changes to epoxy resin systems due to susceptibility of the polymer resin to hydrolysis; oxidation; etc. In this study; the hygrothermal environment was used as an accelerator for the degradation of ACF joints in chip-on-glass (COG) assemblies; which were fabricated in the form of single-lap joints. The effects of aging on the epoxy-based ACF joints were characterized by shear tests and scanning electron microscopy (SEM) at accelerated aging times of 125; 250; 375 and 550 h. The results show that the strength of ACF joints decreases and the fracture mechanism gradually changes with hygrothermal aging. In order to further interpret the hygrothermally-induced degradation to the ACF joints; an ACF joint aging model with hygrothermal environment has been developed; introducing a dimensionless parameter A; which was obtained from the interfacial fracture energy. © VSP 2006;
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摘要：
Journal article (JA)
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页码：1383 / 1399
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