Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

被引：0
|
作者：
Zhang, Zheng [1 ]
Suetake, Aiji [1 ]
Chen, Chuantong [1 ]
Katayama, Osamu [2 ]
Ishino, Hiroshi [2 ]
Endo, Takeshi [2 ]
Sugiura, Kazuhiko [2 ]
Tsuruta, Kazuhiro [2 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Osaka University, Institute of Scientific and Industrial Research, Mihogaoka 8-1, Ibaraki, Osaka,567-0047, Japan
[2] Mirise Technologies Corporation, Power Electronics R and D Div.2, Nisshin, Aichi,470-0111, Japan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
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中图分类号：
学科分类号：
摘要：
Acoustic emission testing - Dies - Health - Power electronics
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页码：91 / 92
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