Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples

被引：0
|
作者：
Hu, Xin-Bin [1 ]
Wen, Jun [1 ]
Yen, Yee-Wen [1 ]
机构：
[1] National Taiwan University of Science and Technology, Department of Materials Science and Engineering, Taipei,10672, Taiwan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Copper alloys - Electronics packaging - Intermetallics - Iron alloys - Lead-free solders - Scanning electron microscopy - Silver alloys - Spectrometers - Substrates - Ternary alloys - Tin alloys
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页码：223 / 224
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