Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples

被引：0
|
作者：
Hu, Xin-Bin [1 ]
Wen, Jun [1 ]
Yen, Yee-Wen [1 ]
机构：
[1] National Taiwan University of Science and Technology, Department of Materials Science and Engineering, Taipei,10672, Taiwan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Copper alloys - Electronics packaging - Intermetallics - Iron alloys - Lead-free solders - Scanning electron microscopy - Silver alloys - Spectrometers - Substrates - Ternary alloys - Tin alloys
引用
收藏
页码：223 / 224
相关论文
共 50 条
  • [1] Interfacial Reactions in the Sn-3.0Ag-0.5Cu/C194 Couples
    Hu, Xin-Bin
    Wen, Jun
    Yen, Yee-wen
    2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022), 2022, : 223 - 224
  • [2] Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate
    Bin Lu
    Hui Li
    Juan-hui Wang
    Hua-wei Zhu
    Xian-he Jiao
    Journal of Central South University of Technology, 2008, 15 : 313 - 317
  • [3] Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate
    Lu Bin
    Li Hui
    Wang Juan-hui
    Zhu Hua-wei
    Jiao Xian-he
    JOURNAL OF CENTRAL SOUTH UNIVERSITY OF TECHNOLOGY, 2008, 15 (03): : 313 - 317
  • [4] Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate
    卢斌
    栗慧
    王娟辉
    朱华伟
    焦羡贺
    JournalofCentralSouthUniversityofTechnology, 2008, (03) : 313 - 317
  • [5] Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging
    Chien-Fu Tseng
    Kai-Jheng Wang
    Jenq-Gong Duh
    Journal of Electronic Materials, 2010, 39 : 2522 - 2527
  • [6] Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging
    Tseng, Chien-Fu
    Wang, Kai-Jheng
    Duh, Jenq-Gong
    JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (12) : 2522 - 2527
  • [7] Effect of Adding Er on Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder and Cu Substrate
    Li Hui
    Lu Bin
    FRONTIER IN FUNCTIONAL MANUFACTURING TECHNOLOGIES, 2010, 136 : 28 - 32
  • [8] Cross-solder interaction on interfacial reactions in Ni/Sn-3.0Ag-0.5Cu/Cu solder interconnects
    Fan, M.
    Huang, M. L.
    Zhao, N.
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 542 - 545
  • [9] Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Sputter Cu-Ti Alloy Film UBM
    Yupeng Wang
    Haibin Liu
    Mingdong Bao
    Wenhao Yang
    Bing Zhou
    Hung-Chun Wu
    Journal of Electronic Materials, 2021, 50 : 3692 - 3698
  • [10] Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Sputter Cu-Ti Alloy Film UBM
    Wang, Yupeng
    Liu, Haibin
    Bao, Mingdong
    Yang, Wenhao
    Zhou, Bing
    Wu, Hung-Chun
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (06) : 3692 - 3698
12345