Breaking Barriers: Sheet Processor Makes Move on High-End Packaging Market

被引：0
|
作者：
Callari, Jim
机构：
来源：
Plastics Technology | 2023年 / 66卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
(Edited Abstract)
引用
收藏
页码：30 / 32
相关论文
共 50 条
  • [31] Packaging Sustainability through renewable Resources High-End Packaging Machines Process environmentally friendy Packaging Materials for Microwave Dishes
    Martin, Bernard
    Meyer, Klaus
    FLEISCHWIRTSCHAFT, 2012, 92 (07): : 50 - 51
  • [32] ANALOG DESIGN, HIGH-END PACKAGING ISSUES ARE EDA HOT-SPOTS AT CICC
    MALINIAK, L
    ELECTRONIC DESIGN, 1993, 41 (09) : 52 - &
  • [33] Working Long Hours and Early Career Outcomes in the High-End Labor Market
    Gicheva, Dora
    JOURNAL OF LABOR ECONOMICS, 2013, 31 (04) : 785 - 824
  • [34] Explanatory drivers of the international high-end art market trends in the XXI century
    De la Poza, Elena
    Guadalajara, Natividad
    Wang, Ruijing
    INTERNATIONAL WORK-CONFERENCE ON TIME SERIES (ITISE 2014), 2014, : 240 - 248
  • [35] Upstream Dependence of China's High-End Manufacturing Sector on the International Market
    Shang, Lijing
    Aman, Saiful
    Rahmat, Abdulkhabir
    CHINESE ECONOMY, 2024,
  • [36] High-End Products Lead the C5 Petroleum Resin Market
    Pan Guangqin
    ChinaChemicalReporter, 2009, 20 (19) : 21 - 21
  • [37] Transistor-level tools for high-end processor custom circuit design at IBM.
    Bard, Karen
    Dewey, Bill
    Hsu, Mei-Ting
    Mitchell, Tom
    Moody, Karl
    Rao, Vasant
    Rose, Ron
    Soreff, Jeff
    Washburn, Steve
    PROCEEDINGS OF THE IEEE, 2007, 95 (03) : 530 - 554
  • [38] TEMBOARDS NEW MILL AIMS FOR THE HIGH END OF THE PACKAGING MARKET
    RODDEN, G
    PULP & PAPER-CANADA, 1990, 91 (07) : 15 - &
  • [39] Development of Chip-on-Wafer (CoW) Stacked Chip Packaging for High-end CIS Application
    Ni, Tom
    Lien, Lisa
    Chen, Nuno
    Huang, K. Y.
    Chang, Winson
    Chung, K. W.
    Huang, Wesley
    Wang, Roger
    Chen, M. J.
    Liu, Alex
    Hsu, S. C.
    Lin, James
    Chang, C. C.
    Tai, Johnson
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 555 - 559
  • [40] MAP3D - a media processor approach for high-end 3D graphics
    Darsa, L
    Stadnicki, S
    Basoglu, C
    MEDIA PROCESSORS 2000, 2000, 3970 : 100 - 107
12345