The Non-Destructive Three-Dimensional Analysis of Crack in Solder Joints Employing by Deep Learning Technique

被引:0
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作者
Hasegawa, Masashi [1 ]
Onizuka, Riri [2 ]
Ogata, Shin [2 ]
Ueki, Ryusuke [1 ]
Takahashi, Masanori [1 ]
机构
[1] R&D development, Qualtec Co., Ltd., 4-230, Sambo-cho, Sakai-ku, Sakai-shi,590-0906, Japan
[2] Quality Technology development, Qualtec Co., Ltd., 4-230, Sambo-cho, Sakai-ku, Sakai-shi,590-0906, Japan
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10.5104/jiep.27.466
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页码:466 / 471
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