The Non-Destructive Three-Dimensional Analysis of Crack in Solder Joints Employing by Deep Learning Technique

被引：0
|
作者：
Hasegawa, Masashi [1 ]
Onizuka, Riri [2 ]
Ogata, Shin [2 ]
Ueki, Ryusuke [1 ]
Takahashi, Masanori [1 ]
机构：
[1] R&D development, Qualtec Co., Ltd., 4-230, Sambo-cho, Sakai-ku, Sakai-shi,590-0906, Japan
[2] Quality Technology development, Qualtec Co., Ltd., 4-230, Sambo-cho, Sakai-ku, Sakai-shi,590-0906, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2024年 / 27卷 / 05期
关键词：
D O I：
10.5104/jiep.27.466
中图分类号：
学科分类号：
摘要：
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页码：466 / 471
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