Low temperature sintering of power chip by carbon nanotube-graphene reinforced nano-Ag paste

被引：0
|
作者：
Zhu, Tang-Kui [1 ]
Li, Guo-Chao [2 ]
Zhang, Hong-Qiang [3 ]
机构：
[1] Yiwu Industrial and Commercial College, Jinhua,322000, China
[2] School of Engineering, Southwest Petroleum University, Nanchong,637001, China
[3] School of Mechanical Engineering& Automation, Beihang University, Beijing,100084, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2021年 / 31卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：3574 / 3582
相关论文
共 50 条
  • [21] Abnormal swelling behavior of sintering nano-Ag joint during high-temperature ageing
    Du, Zhipeng
    Yang, Fan
    Zhao, Jianlan
    Li, Mingyu
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [22] Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
    Gao, Lihua
    Zou, Shuangyang
    Zheng, Changcheng
    Mu, Dekui
    METALS, 2023, 13 (11)
  • [23] Pressureless and low temperature sintering by Ag paste for the high temperature die-attachment in power device packaging
    Wang, Chuncheng
    Zhang, Xu
    Zhang, Yudui
    Zhao, Tao
    Zhu, Pengli
    Sun, Rong
    Nishikawa, Hiroshi
    Xu, Liang
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2256 - 2262
  • [24] The Promotional Effect of Ag in Pd-Ag/Carbon Nanotube-Graphene Electrocatalysts for Alcohol and Formic Acid Oxidation Reactions
    Rajesh, D.
    Mahendiran, C.
    Suresh, C.
    CHEMELECTROCHEM, 2020, 7 (12) : 2629 - 2636
  • [25] Research progress of low temperature sintering nano-silver paste
    Yang W.
    Hu S.
    Zhu W.
    Li M.
    Hanjie Xuebao/Transactions of the China Welding Institution, 2022, 43 (11): : 137 - 146
  • [26] Nano-interface effect of graphene on carbon nanotube reinforced carbon/carbon composites
    Han, Liyuan
    Xiao, Caixiang
    Song, Qiang
    Yin, Xuemin
    Li, Wei
    Li, Kezhi
    Li, Yunyu
    CARBON, 2022, 190 : 422 - 429
  • [27] Microstructural evolution and degradation mechanism of SiC-Cu chip attachment using sintered nano-Ag paste during high-temperature ageing
    Yang, Fan
    Zhu, Wenbo
    Wu, Weizhen
    Ji, Hongjun
    Hang, Chunjin
    Li, Mingyu
    JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 846
  • [28] Achieving Low-Porosity Sintering of Nano Ag Paste via Pressureless Process
    Chen, Sihai
    Fan, Guangyu
    Yan, Xue
    LaBarbera, Chris
    Kresge, Lee
    Lee, Ning-Cheng
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1795 - 1802
  • [29] Shape Synergy of Ag@Cu Chip Packaging Nano-Paste and Its Sintering Reliability
    Yin, Changhao
    Guo, Wei
    Zhao, Wenyi
    Zhang, Cheng
    Peng, Zilong
    Zou, Guisheng
    Jia, Qiang
    Zhang, Hongqiang
    ADVANCED ENGINEERING MATERIALS, 2025, 27 (01)
  • [30] Fabrication of superhydrophobic coatings by low-temperature sintering of Ag nanoparticle paste
    Zhang, Chenghao
    Li, Chun
    Zheng, Mushi
    Si, Xiaoqing
    Gao, Dejun
    Qi, Junlei
    Cao, Jian
    MATERIALS TODAY COMMUNICATIONS, 2022, 33
12345