Physics-Informed Compact Model for SF6/O2 Plasma Etching

被引：0
|
作者：
Filipovic, Lado [1 ,2 ]
Bobinac, Josip [2 ]
Piso, Julius [2 ]
Reiter, Tobias [1 ,2 ]
机构：
[1] Cdl for Multi-Scale Process Modeling of Semiconductor Devices and Sensors, Austria
[2] Tu Wien, Institute for Microelectronics, Vienna,1040, Austria
来源：
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD | 2023年
关键词：
Compendex;
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学科分类号：
摘要：
Sulfur hexafluoride
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页码：73 / 76
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