Preparation and Properties of Shape Memory Hydrogenated Bisphenol A Epoxy Resin

被引:0
|
作者
Zhou X. [1 ]
Ma B. [2 ]
Wei K. [2 ]
Bo Y. [2 ]
机构
[1] School of Modern Posts & Institute of Posts, Xi'an University of Posts & Telecommunications, Xi'an
[2] School of Highway, Chang'an University, Xi'an
来源
| 2018年 / Cailiao Daobaoshe/ Materials Review卷 / 32期
关键词
Glass transition temperature; Hydrogenated bisphenol A epoxy resin; Shape memory property; Storage modulus;
D O I
10.11896/j.issn.1005-023X.2018.18.031
中图分类号
学科分类号
摘要
In order to study the effect of polypropylene glycol diglycidyl ether (JH-230) on the basic properties of thermosetting shape memory epoxy resin, a novel shape memory hydrogenated bisphenol A epoxy resin was prepared by the hydrogenated bisphenol A epoxy resin (AL-3040), polypropylene glycol diglycidyl ether (JH-230) and isophorone diamine (IPDA) with different molar ratios between the AL-3040 and the JH-230. The molecular structures of the thermosetting shape memory epoxy resin were mea-sured by the flourier transform infrared spectroscopy (FT-IR), the glass-transition temperature (T g ) of the epoxy resin was studied by the differential scanning calorimetry (DSC), and the corresponding storage modulus and shape memory property were observed by the dynamic thermomechanical analyzer (DMA) and tensile-recovery shape memory test. Results showed that the flexibility of the epoxy resin increased and the T g of the epoxy resin decreased with increased JH-230 content. The storage modulus of the epoxy resin decreased and the complete recovery time of the epoxy resin extended with increased JH-230 content. It was suggested that the flexibility, T g and storage modulus of epoxy resin can be controlled by adjusting the JH-230 content, and the shape memory hydrogenated bisphenol A epoxy resin has good shape memory property. © 2018, Materials Review Magazine. All right reserved.
引用
收藏
页码:3271 / 3275
页数:4
相关论文
共 16 条
  • [11] Wei K., Zhu G.M., Tang Y.S., Et al., Research progress in thermoset shape memory epoxy resin, Polymer Materials Science & Engineering, 8, (2012)
  • [12] Wu J.Q., Yu K.J., Q K., Et al., Study on tensile properties of epoxy resin composites with MWCNTs/f-GN hybrid materials, Materials Review B: Research Papers, 28, 5, (2014)
  • [13] Li J.N., Yu K.J., Q K., Et al., The reinforcing and toughening effect of grapheme/SiO <sub>2</sub> hybrid material on epoxy-based composites , Materials Review B: Research Papers, 28, 10, (2014)
  • [14] Wu J.J., Xie J.W., Wang Z.J., Et al., Study of F-48 Epoxy Resin Modified Bisphenol a Cyanate Ester resins, Materials Review B: Research Papers, 28, 7, (2014)
  • [15] Xie T., Rousseau I.A., Facile tailoring of thermal transition temperatures of epoxy shape memory polymers, Polymer, 50, 8, (2009)
  • [16] Sokolowski W.M., Tan S.C., Advanced self-deployable structures for space applications, Spacecraft Rockets, 44, 4, (2007)