Tin-nickel alloy plating

被引：0

作者：

Jalota, S.K. ^{[1
]}

机构：

[1] CSL Inc., Santa Clara, CA, United States

来源：

Metal Finishing | 2007年 / 105卷 / 10期

关键词：

D O I：

10.1016/S0026-0576(07)80345-X

中图分类号：

学科分类号：

摘要：

(Edited Abstract)

引用

页码：272 / 275

共 50 条

[31] DETERMINATION OF POROSITY IN ELECTRODEPOSITED COATINGS OF GOLD AND TIN-NICKEL ALLOY ON COPPER SUBSTRATES
ANTLER, M
DROZDOWICZ, MH
PLATING AND SURFACE FINISHING, 1978, 65 (04): : 39 - 42
[32] ELECTROLYTIC DEPOSITION OF A TIN-NICKEL ALLOY FROM CHLORIDE-FLUORIDE SOLUTIONS
TIUTINA, KM
KUDRIAVTSEV, NT
DOKLADY AKADEMII NAUK SSSR, 1957, 115 (03): : 580 - 582
[33] The Preparation and Performance Study of Tin-nickel Alloy Based Lithium Battery Anode Material
Feng, Liming
Liu, Yan
Zhang, Jiangang
MATERIALS FOR ENERGY CONVERSION AND STORAGE, 2012, 519 : 113 - 117
[34] ANODIC POLARIZATION OF TIN, NICKEL, AND A 65-35 TIN-NICKEL ALLOY IN ALKALINE MEDIA CONTAINING HALIDE-IONS
ABDELAAL, MS
OSMAN, AH
CORROSION, 1980, 36 (11) : 591 - 596
[35] OXIDE-FILMS ON SPUTTERED TIN-NICKEL ALLOY EXPOSED TO PURE OXYGEN AND AIR
SHARMA, SP
THOMAS, JH
ANALYTICAL CHEMISTRY, 1977, 49 (07) : 987 - 990
[36] DETERMINATION OF POROSITY IN ELECTRODEPOSITED COATINGS OF GOLD AND TIN-NICKEL ALLOY ON COPPER SUBSTRATES.
Antler, Morton
Drozdowicz, Michael H.
1600, (65):
[37] BRIDGED COMPLEXES AND THE DEPOSITION OF TIN-NICKEL ALLOYS
RAU, RL
BAILAR, JC
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1960, 107 (09) : 745 - 748
[38] ELECTRODEPOSITION OF TIN-NICKEL ALLOY FROM SULFURIC-ACID ELECTROLYTE WITH ORGANIC ADDITIVES
MEDVEDEV, GI
SHMACHKOVA, IG
RUSSIAN JOURNAL OF APPLIED CHEMISTRY, 1994, 67 (09) : 1256 - 1260
[39] ELECTRODEPOSITED TIN-NICKEL THERMAL-STABILITY
HORNIG, CF
BOHLAND, JF
SCRIPTA METALLURGICA, 1977, 11 (04): : 301 - 304
[40] STRUCTURE AND PROPERTIES OF ELECTRODEPOSITED TIN-NICKEL ALLOYS
KARNAUKHOV, BG
KOZLOV, VM
MAMONTOV, EA
SOVIET ELECTROCHEMISTRY, 1981, 17 (03): : 297 - 302

← 1 2 3 4 5 →