IC package solutions for high-performance memory

被引：0
|
作者：
Solberg, V. [1 ]
机构：
[1] Tessera Inc., San Jose, CA, United States
来源：
Semiconductor International | 2001年 / 24卷 / 10期
关键词：
D O I：
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学科分类号：
摘要：
Chip scale packages
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页码：99 / 104
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