Effect of temperature and coatings on the wettability of Sn-Zn-Ga-Nd lead-free solder

被引：0
|
作者：
Xue, Peng [1 ]
Xue, Songbai [1 ]
Shen, Yifu [1 ]
Long, Weimin [2 ]
Zhang, Qingke [2 ]
Ma, Jia [2 ]
机构：
[1] College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
[2] State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2013年 / 34卷 / 08期
关键词：
Soldering - Bismuth alloys - Lead alloys - Neodymium alloys - Ternary alloys - Tin alloys - Binary alloys - Zinc alloys - Substrates - Lead-free solders - Gallium alloys - Wetting;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The wetting time and wetting force of Sn-Zn-Ga-Nd lead-free solder on Sn, SnBi, Au/Ni coatings under different temperatures were measured, and the effect of soldering temperature on the wettability of solders on different coatings was investigated. The results indicate that with the increase of temperature, the wetting time reduced and the wetting force increased evidently. At 240°C, the wetting time for three coatings all met the needs of IPC standard in which the wetting time t0≤1 s at wave soldering. On the other hand, the wettability of the solder was better on Sn/Cu and SnBi/Cu substrates than on Au/Ni/Cu substrate.
引用
收藏
页码：31 / 34
相关论文
共 50 条
  • [1] Effects of temperature and coatings on wettability of Sn-Cu-Ni lead-free solder
    College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
    不详
    Hanjie Xuebao, 2006, 10 (53-56):
  • [2] Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga
    Peng Xue
    Song-bai Xue
    Yi-fu Shen
    Hong Zhu
    Journal of Materials Science: Materials in Electronics, 2014, 25 : 2671 - 2675
  • [3] Inhibiting the growth of Sn whisker in Sn-9Zn lead-free solder by Nd and Ga
    Xue, Peng
    Xue, Song-bai
    Shen, Yi-fu
    Zhu, Hong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (06) : 2671 - 2675
  • [4] Electrochemical investigation on the effect of silver addition on wettability of Sn-Zn system lead-free solder
    Takemoto, Tadashi
    Funaki, Tatsuya
    Matsunawa, Akira
    Welding Research Abroad, 2000, 46 (02):
  • [5] Effect of temperature on electrochemical corrosion of Zn-30Sn lead-free solder
    Wang, Zhenghong
    Yang, Zelin
    Zeng, Shenbo
    Zhang, Gong
    Liu, Jianchun
    Chen, Chuantong
    Suganuma, Katsuaki
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 10 - 14
  • [6] Investigation on properties of Ga to Sn-9Zn lead-free solder
    Chen, Wenxue
    Xue, Songbai
    Wang, Hui
    Wang, Jianxin
    Han, Zongjie
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 21 (05) : 496 - 502
  • [7] Investigation on properties of Ga to Sn–9Zn lead-free solder
    Wenxue Chen
    Songbai Xue
    Hui Wang
    Jianxin Wang
    Zongjie Han
    Journal of Materials Science: Materials in Electronics, 2010, 21 : 496 - 502
  • [8] Wettability of Sn-Zn-Bi Based Lead-Free Solder with Rare Earths
    Zhang Jiangang
    Journal of Rare Earths, 2006, (05) : 632 - 632
  • [9] Microstructure and properties of Sn-Zn-Ga-xPr lead-free solder
    Li, Yang
    Xue, Songbai
    Yang, Jingqiu
    Ye, Huan
    Chen, Cheng
    Gu, Liyong
    Gu, Wenhua
    Hanjie Xuebao/Transactions of the China Welding Institution, 2012, 33 (05): : 33 - 36
  • [10] The study on the new type lead-free solder alloys Sn-Zn-Ga
    Chen, GH
    Li, XY
    Geng, ZT
    Ma, JS
    RARE METAL MATERIALS AND ENGINEERING, 2004, 33 (11) : 1222 - 1225
12345