Gettinq ready to rework lead-free

A basic understanding of rework system design is required for getting ready for lead-free rework. This relates to the capabilities and/or limitations of a rework system to achieve repeated satisfactory repair results for lead-free rework applications. A system should be flexible enough to handle both small flip chip packages and large area array packages. Other key considerations include heating control, uniformity in heating being delivered, and soak time necessary for effective lead-free rework. Simplifying the rework process can be accomplished if the rework system has significant development processes integrated into its software package, which include minimizing initial data inputs, auto profiling, and profile analysis software. Other system design considerations also include adaptable board handling, reflow nozzle sizes/design/limitations, component and board heat source, sources for air, and other variables required to handle a broad variety of components and boards.