Dielectric strength of CuCr25 series alloys

被引：0
|
作者：
机构：
来源：
| 2001年 / Xi'an High Voltage Apparatus Research Institute卷 / 37期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] CuCr25系列合金的耐电压强度
    张程煜
    王江
    张晖
    杨志懋
    丁秉钧
    秦国义
    高压电器, 2001, (04) : 7 - 9
  • [42] Influence of microstructure of CuCr25 cathode on the motion of vacuum arc spots
    Yang, ZM
    Zhang, QL
    Zhang, CY
    Sun, Y
    Ding, BJ
    PHYSICS LETTERS A, 2006, 353 (01) : 98 - 100
  • [43] 石墨烯强化CuCr25合金的制备与性能
    肖文凯
    穆迪琨祺
    翟显
    阮学锋
    王国栋
    稀有金属材料与工程, 2017, 46 (12) : 3862 - 3867
  • [44] CuCr25触头材料的制造工艺及其性能
    黄国伟
    电工材料, 2001, (01) : 10 - 12
  • [45] Microstructure and properties of vacuum electron beam facing CuCr25 contact material
    Durakov, Vasily G.
    Gnyusov, S. F.
    Dampilon, B. V.
    Dehonova, S. Z.
    Ubiennykh, B. I.
    25TH INTERNATIONAL SYMPOSIUM ON DISCHARGES AND ELECTRICAL INSULATION IN VACUUM (ISDEIV 2012), 2012, : 525 - 528
  • [46] STUDY ON INCLUSIONS IN CuCr25 PREPARED BY THERMIT REDUCTION-ELECTROMAGNETIC CASTING
    Dou, Zhihe
    Wang, Cong
    Shi, Guanyong
    Zhang, Ting'an
    Zhang, Hongyan
    6TH INTERNATIONAL SYMPOSIUM ON HIGH-TEMPERATURE METALLURGICAL PROCESSING, 2015, : 35 - 42
  • [47] High Current Vacuum Arc Phenomena of Nanocrystalline CuCr25 Contact Material
    Yu, Li
    Wang, Jianhua
    Geng, Yingsan
    Kong, Guowei
    Liu, Zhiyuan
    ISDEIV 2010: XXIVTH INTERNATIONAL SYMPOSIUM ON DISCHARGES AND ELECTRICAL INSULATION IN VACUUM, 2010, : 228 - 231
  • [48] Research on properties of CuCr25 contact materials after deformation and heat treatment
    Tian, Bao-Hong
    Zhu, Jian-Juan
    Liu, Ping
    Ren, Feng-Zhang
    Liu, Yong
    Jia, Shu-Guo
    Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2007, 28 (SUPPL.): : 126 - 129
  • [49] On breaking capacity of the CuCr25 composite material produced with electron-beam cladding
    Schneider, A.
    Popov, S.
    Durakov, V. G.
    Dampilon, B. V.
    Dehonova, S. Z.
    Batrakov, A.
    25TH INTERNATIONAL SYMPOSIUM ON DISCHARGES AND ELECTRICAL INSULATION IN VACUUM (ISDEIV 2012), 2012, : 269 - 271
  • [50] 冷却速度对CuCr25合金凝固过程的影响(英文)
    王宥宏
    孙占波
    周轩
    宋晓平
    稀有金属材料与工程, 2006, (08) : 1289 - 1293
12345