Directional solidification of eutectic SnAgCu solder alloy

被引：0
|
作者：
Zuo, Yong [1 ]
Ma, Liming [1 ]
Xu, Guangchen [1 ]
Guo, Fu [1 ]
机构：
[1] Beijing University of Technology, Beijing 100124, China
来源：
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering | 2013年 / 42卷 / 05期
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摘要：
15
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页码：1048 / 1052
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