Room-Temperature Wafer Direct Bonding Using Surface Smoothing by Ion Beam

被引：0
|
作者：
Takagi, Hideki [1 ]
Kurashima, Yuichi [1 ]
Maeda, Atsuhiko [1 ]
机构：
[1] National Institute of Advanced Industrial Science and Technology (AIST), AIST-Tsukuba-east, Namiki 1-2-1, Tsukuba, Ibaraki, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2015年 / 18卷 / 07期
关键词：
D O I：
10.5104/jiep.18.469
中图分类号：
学科分类号：
摘要：
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页码：469 / 473
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