Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

被引：0
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作者：
机构：
[1] [1,Zhang, Liang
[2] Fan, Xi-Ying
[3] He, Cheng-Wen
[4] Guo, Yong-Huan
来源：
Zhang, L. (zhangliang@nuaa.edu.cn) | 2013年 / Springer Science and Business Media, LLC卷 / 24期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
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学科分类号：
摘要：
Activation energy - Soldering - Silver alloys - Ternary alloys - Tin alloys - Copper - Substrates - Growth kinetics - Binary alloys - Lead-free solders
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