Package design

被引：0
|
作者：
Ammann, Les
机构：
来源：
Advanced Packaging | 2002年 / 11卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] USE OF ELECTRONICS IN PACKAGE DESIGN
    GOFF, JW
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS AND CONTROL INSTRUMENTATION, 1964, IE11 (01): : 57 - &
  • [22] FLOOR POLISH PACKAGE DESIGN
    SNYDER, G
    SOAP AND CHEMICAL SPECIALITIES, 1970, 46 (09): : 89 - &
  • [23] Peculiarities of Package Ecological Design
    Kibirkstis, E.
    Kabelkaite, A.
    MECHANIKA 2010: PROCEEDINGS OF THE 15TH INTERNATIONAL CONFERENCE, 2010, : 236 - 241
  • [24] Investigation of Design and Material Optimization on High bandwidth Package on Package
    Hu, Ian
    Lai, Wei-Hong
    Wang, Ming-Han
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 839 - 843
  • [25] DESIGN AND CONSTRUCTION OF ELECTRONICS PACKAGE
    SHENNUM, RH
    REID, EJ
    BELL SYSTEM TECHNICAL JOURNAL, 1963, 42 (04): : 1749 - +
  • [26] What package design costs
    ANON
    1971, 44 (07): : 38 - 39
  • [27] PACKAGE DESIGN COSTS NOT DEDUCTIBLE
    不详
    JOURNAL OF TAXATION, 1986, 65 (01): : 53 - 54
  • [28] INSECT RESISTANT PACKAGE DESIGN
    HIGHLAND, HA
    ACTIVITIES REPORT-RESEARCH AND DEVELOPMENT ASSOCIATES FOR MILITARY FOOD AND PACKAGING SYSTEMS INC, 1978, 30 (01): : 36 - 36
  • [29] TECHNIQUES FOR PACKAGE PRINTING AND DESIGN
    TOLLETTE, HB
    TAPPI JOURNAL, 1988, 71 (09): : 137 - 141
  • [30] GOLD - PACKAGE DESIGN PLUS
    BEATON, G
    SOAP COSMETICS CHEMICAL SPECIALTIES, 1976, 52 (02): : 67 - 68
12345