共 50 条
- [31] Process Dependent Material Characterization for Warpage Control of Fan-Out Wafer Level Packaging IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 2165 - 2170
- [33] New results in the calculation of modulation products BELL SYSTEM TECHNICAL JOURNAL, 1933, 12 : 228 - 243
- [34] Ancient Handcraft Improved by New Material ADVANCES IN DESIGN FOR INCLUSION, 2020, 954 : 399 - 405
- [38] New device and method for soil shrinkage curve measurement and characterization Soil Science Society of America Journal, 63 (03): : 525 - 535