Annealing process thermal stress evaluation for LSI copper conductors

被引：0
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作者：
Inoue, Takao
Miyagaki, Aki
Onishi, Takashi
Yoshikawa, Tetsuya
机构：
来源：
R and D: Research and Development Kobe Steel Engineering Reports | 2002年 / 52卷 / 02期
关键词：
Constitutive equations - Copper conductors - Copper films - High annealing temperatures;
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页码：78 / 82
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