Resistance network for predicting the thermal conductivity of composite materials

被引：0
|
作者：
Zhang, Hai-Feng [1 ]
Ge, Xin-Shi [1 ]
Ye, Hong [1 ]
机构：
[1] Department of Thermal Science and Energy Engineering, University of Science and Technology of China, Hefei 230027, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2005年 / 36卷 / 05期
关键词：
Computer simulation - Heat resistance - Mathematical models - Packaging materials - Thermal conductivity;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Based on the randomly generated structure of particulate filled composite materials, a numerical method was developed for predicting thermal conductivity. After numerical code was validated, the difference between the 2D and 3D and the effect of the sample scale are analyzed. The thermal conductivities of epoxy-silica and the Ni-ZrO2 composites are calculated. Compared with the experimental data, the proposed method can be used to predict thermal conductivity in wide range of the volume fraction.
引用
收藏
页码：757 / 759
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