共 50 条
- [32] DFM of Soldering Pad of QFP and DIP for Wave Soldering 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 642 - 647
- [33] A 7 STEP PROCESS FOR QUALITY IMPROVEMENT TOTAL QUALITY AND PARTICIPATION : TODAYS INVESTMENT IN TOMORROWS SUCCESS, 1991, : 37 - 43
- [36] Step-by-step realization of the signalling network CCITT No. 7 Elektrotehnika Zagreb, 1988, 31 (3-4): : 153 - 161