共 50 条
- [43] Kinetic analysis of curing of epoxy resin containing phthalazinone structure Huagong Xuebao/CIESC Journal, 2022, 73 (02): : 681 - 688
- [46] Application of Printed Paper Sensors in Characterizing Curing Behavior of Thermosetting Resin Systems Using Dielectric Spectroscopy 2023 INTERNATIONAL WORKSHOP ON IMPEDANCE SPECTROSCOPY, IWIS, 2023, : 138 - 141
- [50] A new method of curing epoxy resin by using bis(heptaphenylaluminosil- sesquioxane) as a hardener Chmielewska, D. (danuta.chmielewska@docto-rate.put.poznan.pl), 1600, Industrial Chemistry Research Institute (58):