A proposal for strain measurement in electronic packages using phase-shifted sampling moiré method

This paper proposes a novel approach to measuring residual strains in electronic packages. The proposed method includes applying a phase-shifted sampling moiré method to X-ray CT images of the test chip in the electronic package. In addition, a calibration method for calculating the residual strains on the test chip is shown in this paper. As an example, the proposed method is applied to an analysis of the residual strains incurred during resin molding of a QFP. The proposed method is verifed by comparing the results to a strain analysis using the fnite element method. It is demonstrated that the proposed method is efective as a method of measuring residual strains in electronic packages. © Japan Institute of Electronics Packaging. All rights reserved.