Preparation and properties of organoclay/polyethersulfone/ epoxy hybrid nanocomposites

Organoclay/polyethersulphone/epoxy hybrid nanocomposites were prepared by solvent method and melting method, respectively. Their tensile properties, fracture toughness, thermal properties and microstructures were then characterized. Their tensile strength arrived at 75 MPa, modulus reached 2.8GPa, and fracture toughness was over 1.1MPam1/2. Synergistic toughening effect of the polyethersulphone and organoclay on the epoxy resin was observed. Semi-interpenetrating network of the polyethersulphone/ epoxy matrix was found by dynamic mechanical thermal analyzer (DMA) and transmission electron microscope (TEM). The results of X-ray diffractometer (XRD) analysis and TEM observation reveal that the organoclay possessed ordered exfoliated morphologies. Glass transition temperatures (Tgs) of the two hybrid nanocomposites were tested by dynamic mechanical thermal analysis (DMTA). The Tg of the specimen prepared by the solvent method was found higher than 170℃, while that by the melting method was more than 180℃. © Copyright.