SOCC 2019 Welcome Message from the Technical Program Chairs

被引:0
|
作者
Zhao, Danella [1 ]
Basu, Arindam [2 ]
机构
[1] Old Dominion University, United States
[2] Nanyang Technological Univ., Singapore
来源
International System on Chip Conference | 2019年 / 2019-September卷
关键词
D O I
10.1109/SOCC46988.2019.9088082
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [11] Welcome Message from the Technical Program Chairs
    Mercado-Shekhar, Karla P.
    Panicker, Mahesh R.
    SAUS 2024 - IEEE South Asian Ultrasonics Symposium, Proceedings, 2024,
  • [12] Welcome message from the technical program chairs
    Zhang, Lei
    Piuri, Vincenzo
    Emerging Techniques and Challenges for Hand-Based Biometrics, ETCHB 2010, 2010,
  • [13] Welcome message from the technical program chairs
    1600, Institute of Electrical and Electronics Engineers Inc.
  • [14] Welcome Message from the Technical Program Chairs
    1600, Institute of Electrical and Electronics Engineers Inc. (2020-October):
  • [15] Welcome message from the technical program chairs
    GlobalSIP 2019 - 7th IEEE Global Conference on Signal and Information Processing, Proceedings, 2019,
  • [16] Welcome message from technical program chairs
    Chiao, J.-C.
    Mortazawi, Amir
    Afridi, K.K.
    Avestruz, A.-T.
    2021 IEEE Wireless Power Transfer Conference, WPTC 2021, 2021,
  • [17] Welcome Message from the Technical Program Chairs
    Morris, Terry
    Smith, Nils
    AIAA/IEEE Digital Avionics Systems Conference - Proceedings, 2021, 2021-October
  • [18] Welcome Message from the Technical Program Chairs
    Lozano, Angel
    IEEE Wireless Communications and Networking Conference, WCNC, 2022, 2022-April
  • [19] Welcome message from the technical program chairs
    Bhatia, Karan
    Alioto, Massimo
    International System on Chip Conference, 2017,
  • [20] Welcome Message from the Technical Program Chairs
    Hendric, Spits Warnars Harco Leslie
    Mitsuhara, Hiroyuki
    Goda, Yoshiko
    Hutagalung, Fonny Dameaty
    TALE 2019 - 2019 IEEE International Conference on Engineering, Technology and Education, 2019,