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- [21] Challenges in the Reliability of 3D Integration using TSVs 2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
- [22] High Aspect Ratio TSVs in Micropin-Fin Heat Sinks for 3D ICs 2012 12TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2012,
- [23] Full-Chip Multiple TSV-to-TSV Coupling Extraction and Optimization in 3D ICs 2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
- [24] A study on substrate noise coupling among TSVs in 3D chip stack IEICE ELECTRONICS EXPRESS, 2018, 15 (13):
- [25] Coupling Capacitance in Face-to-Face (F2F) Bonded 3D ICs: Trends and Implications 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 529 - 536
- [27] The Accelerated 3D Capacitance Extraction Based on Adaptive Low-Rank Matrix Factorization Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics, 2022, 34 (07): : 1138 - 1146
- [28] Design Quality Tradeoff Studies for 3D ICs Built with Nano-scale TSVs and Devices 2012 13TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2012, : 740 - 746
- [29] Equivalent Circuit Model Extraction for Interconnects in 3D ICs 2013 18TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2013, : 1 - 6
- [30] Towards Automatic Thermal Network Extraction in 3D ICs PROCEEDINGS OF THE 2016 IEEE/ACM INTERNATIONAL SYMPOSIUM ON NANOSCALE ARCHITECTURES (NANOARCH), 2016, : 25 - 30